ByteCool- Direct to Chip Liquid Cooling

Product Description

Accelerate Heat Removal at the Source with ByteCool D2C (Direct-to-Chip Cooling)

ByteCool Direct-to-Chip Liquid Cooling is built for the demands of high-performance computing, AI clusters, machine learning workloads, GPT models, and energy-intensive applications. As modern processors reach higher thermal densities and rack power climbs, air cooling alone becomes insufficient.

Direct-to-Chip technology circulates a specialised coolant across the CPU, GPU, or ASIC surface, offering heat-transfer capability thousands of times higher than air. By removing heat at the silicon level, it reduces dependence on high-speed fans and large air volumes.

Once server power exceeds 400 W per device, liquid cooling becomes essential. The ByteCool D2C platform consists of four primary components: coolant distribution units, manifolds and quick-connect fittings, a free-cooling chiller, and a dry cooler.

With the the ByteCool D2C system, each module is integrated according to rack layout, cooling requirements, and site design. This modular approach ensures seamless compatibility for everything from compact AI pods to enterprise-scale HPC installations, while maintaining peak thermal efficiency.

Coolant Distribution Units (CDU) (BT-050-CL, BT-350-CL, BT-010-CA, and BT-060-CL)  

  • Standard 19-inch rack-oriented design, making it easier to adjust with the existing layout and data center plan. 
  • Equipped with an intelligent control system to control, monitor, and access the key working status remotely and locally. 
  • Plug and play design, easy to connect to the IT server with self-healing quick connectors
  • Cooling type: Liquid-Liquid and Liquid-Air 
  • Capacity: 10.5 – 355.5 kW 
  • Supply temperature: 45 °C
  • Coolant: Water and glycol
  • Mount type: Rack mount, floor mount, and row mount; varies as per model

 

Manifolds and Connectors 

  • Manufactured using stainless steel for reliability and rugged durability.
  • Plug and play design, and can be combined with dry disconnects, self-healed quick connectors.
  • Provide an easy interface between cold plate loops in the servers and CDUs. 
  • Supports flexible input and output loop customization and is also vertical and horizontal adaptive. 

ChillFlow Free Cooling Chiller (CF-50 and CF-350)

  • Capacity DX Mode and FC Mode (for both CF 50 and 350): 50 – 350 and 52 – 390
  • It has a natural cooling design that operates in natural cooling mode at low temperatures. 
  • The highly efficient chiller unit’s internal threaded pipeline provides efficient heat exchange. 
  • Compatible with water, water and ethylene glycol mixture, and ensures reliable operation in different regions and environments temperatures
  • Use environment-friendly refrigerants, like R407C and R134A
  • It has an optional wet film evaporation cooling component to pre-cool the intake air, improving the PUE value. 
  • In-depth testing and repeated verification of the system design and device configuration

Dry Cooler (KSF50DC and KSF350DC)

    • Equipped with high high-performance heat exchanger system maximizing efficiency 
  • Capacity (for both KSF50DC and KSF350DC): 50kW and 350kW 
  • Coolant: Water, glycol, or a mixture of water and glycol for ambient temperature 
  • Fan type: VDC 
  • Working range: -35C to +35C 
  • An optional wet film design to pre-cool the air with evaporative cooling effects 
  • High corrosion and durable design, making it suitable for long-term applications.